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MICRON, HYNIX LIKELY TO SIGN MOU SEALING ALLIANCE ON JAN 21.
AsiaPulse News, January, 2002
SEOUL, Jan 11 Asia Pulse - Hynix Semiconductor Inc. and the U.S. chip giant Micron Technology Inc. is expected to sign a memorandum of understanding (MOU) around January 21, that will seal the forging of an alliance between the two companies, an official at the Korean chipmaker said Friday.
The official at Hynix' special restructuring panel said the two sides have been able to further reduce existing gaps during the third round of negotiations this week.
"Broad consensus was reached on how Micron will pay for the takeover of assets and ways to resolve the Korean chipmaker's debt," the official said. Hynix is reported to have debts hovering around US$6.6 billion.
The two sides plan to draw up the MOU through the help of financial advisors Goldman...
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