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ASAT HOLDINGS TO PROVIDE STACKED DIE LPCC TECHNOLOGY TO INTEGRANT TECHNOLOGIES.
AsiaPulse News, July, 2004
(Full text of statement. Contact details below.)
HONG KONG and PLEASANTON, Calif., July 12 /PRNewswire-AsiaNet/ --
ASAT Holdings Limited (Nasdaq: ASTT), a global provider of semiconductor package design, assembly and test, today announced that it will provide stacked die Leadless Plastic Chip Carrier(TM) (LPCC) technology to Integrant Technologies Inc., a Korean-based fabless semiconductor manufacturer, to meet the increasing demand for tri-band mobile chipsets required for next generation wireless phones.
(Photo: http://www.newscom.com/cgi-bin/prnh/20030414/ASATLOGO )
ASAT's leading position in quad flat no-lead (QFN) technology continues to advance with the integration of its stacked die LPCC package. Utilizing its state-of-the-art...
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