Semiconductor International

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Articles in April, 2004 issue of Semiconductor International

• Don't throw offshoring out with the bath water.(editorial)(Editorial)
  by Braun, Alexander E.
• Nanorings could be nanoscale sensors.(Emerging Technologies)
  by Singer, Peter
• New materials and designs improve transistor performance.
  by Singer, Peter
• Growth returning to West European electronics industry.(marketfocus)
• ELASTec[R]: a wafer level package for memory products.(Special Promotional Supplement)
  by Hedler, Harry
• Metrology System.(New Products)(Brief Article)
• MEMC Electronic Materials, Inc.(Web Connection)(Brief Article)
• Light source.(New Products)(Brief Article)
• Elements on demand: infinite alchemy?(Materials & New Technology)
  by Gilleo, Ken
• Panel agrees immersion lithography will happen, but when?(Industry Watch)
  by Peters, Laura
• The U.S. Federal Government is likely to double the test equipment pattern rate threshold for ATE equipment export licenses from 333 MHz to 667 MHz, which would make it easier for U.S.-based test equipment suppliers to ship systems to markets such as Chin
• Pb-free integration moves closer to production.(Special Promotional Supplement)
  by Siblerud, Paul
• Kester.(Company News)(Northrup Grumman's divestment )(Brief Article)
• Power supply.(New Products)(Brief Article)
• Transducer.(New Products)(Brief Article)
• Vacuum diffusers.(New Products)(Brief Article)
• CVI Laser, LLC.(Web Connection)(Brief Article)
• Acoustic screening uncovers package defects.
  by Adams, Tom
• SEM/TEM of the month.(Industry Watch)(Brief Article)
• Moore's Law: the first 70 years.
  by Hammond, Martin L.
• Photolithography for WLP and flip chip bumping.(Special Promotional Supplement)
  by Tonnies, Dietrich
• Dieter Bergaman of IPC.(Company News)(Brief Article)
• X-ray inspection.(New Products)(Brief Article)
• Copper Damascene.(Web Connection)(Brief Article)
• Nanotech Toolkit.(New Products)(Brief Article)
• Sensors.(New Products)(Brief Article)
• Nanotesting for nanotechnology.(Yield Management)(Brief Article)
  by Peters, Laura
• Delta F Oxygen Analyzers.(Web Connection)(Brief Article)
• FSI International (Minneapolis) and SCP Global Tech-nologies Inc. (Boise, Idaho) have settled two lawsuits for pat-ent infringement in the U.S. district court.(Company News)(Brief Article)
• MSP Corporation.(Web Connection)(Brief Article)
• Let your views be known.(On the Web)
• Test sector grows fastest in 2003, leads recovery.(Yield Management)(Brief Article)
  by Peters, Laura
• Practical self-assembly will need a hand from lithography.(Lithography)
  by Hand, Aaron
• Next generation wafer bump reflow processing.(Special Promotional Supplement)
  by Mattson, Kristen
• From wafer level packaging system size packaging.(Special Promotional Supplement)
  by Reichl, Herbert
• Laser marking services.(New Products)(JPSA Laser)(Brief Article)
• Nikko Materials.(Web Connection)(Brief Article)
• More on wafer processing.(On the Web)
• Allegro Microsystems Inc.(Company News)(contracts)(Brief Article)
• IPAC (San Jose) and Twin Advance (Penang, Malaysia) launched a joint design and manufacturing Venture.(Company News)(Brief Article)
• Metrology tool.(New Products)(Brief Article)
• Immersion lithography: free webcast.(On the Web)
• Michael Splinter, Applied Materials president and CEO.(Movers & Shakers)(Interview)
  by Braun, Alexander E.
• Kester--changing to meet the future of electronics.
• NANOCMOS project to explore limits of CMOS.(Wafer Processing)(Complementary Metal Oxide Semiconductor )
  by Singer, Peter
• Low-energy ion implantation meets productivity challenges.(Cover Story)
  by Parrill, Thomas
• Overview of common under bump metallurgies.(Special Promotional Supplement)
  by O'Donnell, Kathy
• Electronics industry update.(Economic Indicator)
• ALD valve.(New Products)(Brief Article)
• Sensor.(New Products)(Brief Article)
• Calibration system.(New Products)(Isotech North America)(Brief Article)
• Advanced packaging for product trends.(Industry Commentary)
  by Murphy, Kenneth
• Filtration reduces defects in advanced lithography.
  by Hall, David
• The roadmap for ESH.(environment, safety and health)
  by Peters, Laura
• Packaging partnership offers WLP infrastructure solutions.(Semiconductor Packaging)(Wafer-level packaging)
  by Reed, Greg
• 300mm integration of an electroplated solder bumping process.(Special Promotional Supplement)
  by Mis, Dan
• Thin-film etching/deposition.(New Products)(Brief Article)
• Dow Corning.(Company News)(Brief Article)
• Imaging camera.(New Products)(Brief Article)
• Laser coder.(New Products)(Brief Article)
• Laser marking on bare die.
  by Cunningham, Aidan
• Optical CD metrology provides sub-nanometer accuracy.(Inspection, Measurement and Test)(Critical dimension )
  by Braun, Alexander E.
• Letter to the editor.(Letter to the Editor)
  by Goldsmith, Steven
• Virtual Industries, Inc.(Web Connection)(Brief Article)
• Poco Graphite, Inc.(Web Connection)(Brief Article)