Semiconductor International

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Articles in February, 2005 issue of Semiconductor International

• Affinity[TM] chillers and heat exchangers.(Product & Supplier Showcase)(Brief Article)
• Chemical vapor and atomic layer deposition.(Product & Supplier Showcase)(Brief Article)
• Poco implant materials and components.(Product & Supplier Showcase)(Brief Article)
• Surface-mount adhesive.(New Products)(Loctite 3629 is a low-temperature cure epoxy adhesive)(Brief Article)
• Higher yields with trench-first BEOL.(Industry Watch)(back end of line)(low-k dielectrics)
  by Peters, Laura
• Photoresists: meet the 193 nm milestone.(Cover Story)
  by Peters, Laura
• Small spot measuring.(New Products)
• Resin.(Product Preview)(USFilter)(Brief Article)
• Spring coupling.(New Products)(Brief Article)
• Valve catalog & CAD files on CD-ROM.(Product & Supplier Showcase)(Plast-O-Matic Valves, Inc)(Brief Article)
• HydrOzone[R].(Product & Supplier Showcase)(Advertisement)
• Seal.(New Products)(TS seal)(Valqua America Inc.)(Brief Article)
• FinFETs used in smallest non-volatile flash memory.(Wafer Processing)
  by Singer, Peter
• Mask aligner.(Product Preview)
• Advanced x-ray systems.(Product & Supplier Showcase)(Jordan Valley Semiconductors )(Brief Article)
• Molecular Imprints.(Product & Supplier Showcase)(Brief Article)
• New metal-oxide process.(Emerging Technologies)(polymer-assisted deposition)(Brief Article)
  by Singer, Peter
• IR platform measures 'bottle' trenches.(Inspection, Measurement & Test)(Infrared)
  by Braun, Alexander E.
• Pressure gauge.(Product Preview)
• Re-designed web site.(Product & Supplier Showcase)(Brief Article)
• SAM system.(Product Preview)(Brief Article)
• Clip attach system.(New Products)(Easyline 8033 )(Brief Article)
• Business Communications Co. Inc.(Company News)(Brief Article)
• Selective solder system.(New Products)(TPD6-25F)(Tamura H.A. Systems Inc.)(Brief Article)
• Edmund Optics releases new 2005 catalog.(Product & Supplier Showcase)(Advertisement)
• 3-D packaging: enables new stackable CSP designs.(Chi-scale packaging)
  by Yoshida, Akito; Miles, Barry; Perelman, Vladimir; Heo, Young Wok; Groover, Richard
• Brewer Science, CON-TACT[R].(Product & Supplier Showcase)(Brief Article)
• CD-SEM.(New Products)(Yosemite SP-1000)(Brief Article)
• Applied Materials and DuPont Photomasks Inc. (DPI, Round Rock, Texas) announced a joint development program for advanced photomasks supporting 90 and 65 nm technology.(Company News)(Brief Article)
• Nanoimprint suppliers gathering support.(Lithography)
  by Hand, Aaron
• Capillary.(New Products)(Nexxus)(Brief Article)
• Carbon-Silicon Carbide for high-density SiPs.(Semiconductor Packaging)
  by Baliga, John
• Chipmakers immerse themselves in 193 wet.
  by Hand, Aaron
• Sensor.(Product Preview)(C. Watlow)(Brief Article)
• LPCVD process.(New Products)(Satin )(Brief Article)
• RFID Kit.(New Products)(RFID Smart Feeder )(Brief Article)
• Ted Vucurevich, Cadence Design Systems, CTO.(Movers & Shakers)(Interview)
  by Braun, Alexander E.
• JSR Corp.(Company News)(Brief Article)
• Validation services.(New Products)(CmController Compact5)(CeTaQ Americas)(Brief Article)
• Economics 101: sticking with 193.(editorial)(Cover Story)
  by Hand, Aaron
• Line edge roughness: is here to stay.
  by Braun, Alexander E.
• Chemical filters.(Product Preview)
• The Da Vinci[TM] Series.(Product & Supplier Showcase)(semiconductor)(Brief Article)
• Capital investment boom raises semiconductor demand.(Economic Indicator)
  by Haughey, James
• Defect inspection.(New Products)(AXi-935)(Brief Article)
• Check out the latest lithography news.(On the Web)
• SoC interface.(New Products)(Centaur Universal)(Brief Article)
• Reliability hazards for 45 nm interconnects.(Yield Management)
  by Peters, Laura
• Photolithography filters.(Product & Supplier Showcase)(Brief Article)
• Slurry.(Product Preview)
• Diffusers.(New Products)(Brief Article)
• "NanoPositioning" supplement catalog.(Product & Supplier Showcase)(PI (Physik Instrument) LP)(Brief Article)
• Aerosol cleaner.(New Products)(Cybersolv is a low-VOC water-based all-purpose aerosol maintenance cleaner)(Brief Article)
• Future ICs: go vertical.
  by Garrou, Philip
• Litho [H.sub.2]O: OPC modeling for immersion lithography.(On the Web)
  by Adam, Konstantinos
• Temperature cycling system.(Product Preview)(Brief Article)
• Chemical filters.(New Products)(Ultipleat PK high-flow chemical filter )(Brief Article)
• Infinity v6.1[TM].(Product & Supplier Showcase)(Abrasive Technology )(Brief Article)
• Semicon China 2005 exhibitors.
• Reliability and accelerated life testing.(Industry Commentary)
  by Suhir, Ephraim
• Micro drilling.(Product & Supplier Showcase)(Brief Article)
• Dry pump.(Product Preview)
• Nikko Materials.(Product & Supplier Showcase)(Brief Article)
• Angle encoder.(New Products)(Signum)(Brief Article)
• As part of a collaboration agreement, ASML (Veldhoven, Netherlands) will deliver a Twinscan XT:1250i immersion lithography system to the Maydan Technology Center at Applied Materials Inc.(Company News)(Brief Article)
• A new approach to low-cost RFID tags.(Emerging Technologies)(OrganicID)(Brief Article)
  by Singer, Peter