Enhanced copper ECP for 45 nm devices.
Semiconductor International, October, 2005 by Hafezi, Hooman; Huang, Yi-Chiau; Zhang, Amy; Singh, Saravjeet; Ngai, Chris
 | Content provided in partnership with |  |
A new copper electrochemical plating (ECP) process was developed to improve gap fill, mounding and defect performance for 45 nm node designs. We examined high-precision wafer immersion dynamics, including a waveform solution correlated with the plating head movement, for enhanced control during the plating process's first critical seconds. This technology was used with a new set of plating additives to improve gap-filling performance.
- Most Popular Articles in Technology
- An overview of continuous data protection
- Why all those current ratings?
- Many countries now have a mobile penetration rate above 100%, report says
- The Tata Group's big telecom gamble: VSNL's recent acquisition of Tyco ...
- MEASURING BANK BRANCH EFFICIENCY USING DATA ENVELOPMENT ANALYSIS: MANAGERIAL ...
- More »
In addition, the use of an encapsulated thief electrode makes it possible to modify current density near the edge of the wafer, compensating for ...
Read the rest of this article with a Free Trial at HighBeam Research.Find Research Guides for:
Find Featured Titles for: Reference
- Academe
- African American Review
- African Arts
- African Studies Review
- Afro-Americans in New York Life and History
- Alabama Heritage
- Alabama Review
- American Mathematical Monthly, The
- Anglican Theological Review
- Annals of Dyslexia
- Arab Studies Quarterly (ASQ)
- Auk, The
- Australian Journal of Anthropology, The
- Christian Century
- Natural History
Most Popular Articles in Technology
- An overview of continuous data protection
- Why all those current ratings?
- Many countries now have a mobile penetration rate above 100%, report says
- The Tata Group's big telecom gamble: VSNL's recent acquisition of Tyco ...
- MEASURING BANK BRANCH EFFICIENCY USING DATA ENVELOPMENT ANALYSIS: MANAGERIAL ...
- More »