Semiconductor International

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Articles in October, 2006 issue of Semiconductor International

• Single Spindle System.
• Alfred J. van Roosmalen, Philips Semiconductors.(Interview)(Interview)
• Israeli High Tech Continues Its Progress (Part II).
• UPW Purification System.(Entegris Inc's LiquidLens UPW)(Brief article)
• Mask Qualification System.(Carl Zeiss SMT)(Brief article)
• Ionization Sensor.(MKS Instruments Inc)(Brief article)
• Copper Abatement System.(Metron Technology Inc)(Brief article)
• Spectroscopic Reflectometer.(Horiba Jobin Yvon's DigiScreen )(Brief article)
• Single-Wafer Cleaning.(Solid State Equipment Corp)(Brief article)
• Linear Motor.(THK America Inc.'s GLM20 )(Brief article)
• Delivery System.
• Reticle Inspection Equipment.
• Packaging Test Chamber.
• Test Handler.
• New Products.
• Inspection/Review System.(Olympus Integrated Technologies of America )(Brief article)
• Transistor Gate Dielectric Physics, Processes and Characterization Evolve.
  by Li, Jianxing; Groenendyk, Adrian; Fuerst, Avi; Carey, Raymond
• Ge Epitaxy on Si: An Enabling High-Performance CMOS Platform.(fabricate germanium on silicon wafers)
• New Products.
• Dicing System.(Advanced Dicing Technologies Ltd's 7100plus)(Brief article)
• Single-Wafer RTP.(Mattson Technology Inc)(rapid thermal processing )(Brief article)
• Fiber-Optic Laser Interferometer.(Renishaw Inc's RLE20 fiber-optic laser encoder system )(Brief article)
• Equipment Management Program.(Flowserve Corp's LifeCycle Advantage)(Brief article)
• Chemical Reuse System.(Solid State Equipment Corp's SSEC 3300 )(Brief article)
• Optical Tables.(Kinetic Systems Inc.)(Brief article)
• Solder Bump Inspection.
• Etch System.
• ADC Software.
• Package Sealing Furnace.
• Measurement Module.
• Imaging Support.
• Reliability Fundamentals at 45 nm.
• Wafer Handling System.
• Packaging Adhesive.
• Single-Wafer Shipper.
• New Products.
• Interconnect Flux.
• Dual Beam Analysis.(FEI Co)(Brief article)
• Perfluoroelastomer for Plasma.(Greene, Tweed & Co )(Brief article)
• Tube Fittings.(NetMotion Inc )(Brief article)
• UV Laser.(Spectra-Physics )(Brief article)
• Wafer Process Module System.(Milara Inc's AWPb 300 )(Brief article)
• Helium Leak Detector.(Vacuum Instrument Corp's MS-60 )(Brief article)
• Actuator.
• Profiling Software.
• Microscopes.
• Plating Computer.
• Helium Leak Detector.
• PVD Tool.
• Times Change at Intel -- What It Means for Manufacturing.
  by McGregor, Jim
• Wafer Backside Coating of Die Attach Adhesives.
• Quartz Material.
• Single-Wafer Shipper.(Infixeon's phoenix)(Brief article)
• OpticalLithography System.(ASML's Twinscan XT:1900i)(Brief article)
• Z Stage.(PI (Physik Instrumente) LP)(Brief article)
• Scanning Electron Microscope.(Hitachi High Technologies Corp)(Brief article)
• Laser-Pattern Generator.(Micronic Laser Systems AB's FPS5100)(Brief article)
• Dispensing Equipment.(nScrypt Inc's Model 150 Series)(Brief article)
• Diffusion Furnance.
• Flow Meter.
• Ceramic Heater.
• Metrology System.
• Spectroscopic Ellipsometer.
• Seals.
• Wafer-Level3-D Integration Moving Forward.
• A New Partnership With SEMI.(Semiconductor industry)
• Vibration Isolation Tool.
• New Products.(Semiconductor industry)
• UPW Purification System.
• Pick-and-Place Robotic Tool.
• Ion Implanter.
• Video Inspection Microscope.(FocalSpot Inc )(Brief article)
• Inspection System.(Comet's Feinfocus HDCT-FOX )(Brief article)
• SEM.(Hitachi High Technologies Corp)(Brief article)
• Cleanrooms.(Clean Air Products's Series 582 )(Brief article)
• Die Bonder.(Datacon Technology GmbH's 2200 evo )(Brief article)
• Modular Control System.
• Packaging Adhesives.
• AOI System.
• Solvent Wipe.

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