Perspectives From the Leading Edge: Tezzaron Announces 3-D IC Multi-Project Wafer Program.

Semiconductor International, March, 2009

Staff

Interconnect consultant Phil Garrou blogs on Tezzaron Semiconductor Inc. (Naperville, Ill.), one of the pioneers in 3-D IC integration, which specializes in high-speed memory products.

For those interested in building prototype 3-D logic devices, Tezzaron announced a multi-project wafer program. Up to 10 participants will design two-layer logic devices to be built and bonded on the shared program wafers. Optionally, each resulting two-layer device may be integrated with a Tezzaron 3-D DRAM device. Both the logic stack and the DRAM integration will use high-density interconnect "...in order to examine global I/O and memory bandwidth capabilities in 3-D ICs."

Unlike university or institute multi-project wafers, Tezzaron says that these...

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