LSI Licenses Flip Chip Packaging Technology. (Up Front).(LSI Logic Corp., Siliconware Precision Industries Ltd.)(Brief Article)

Electronic Packaging & Production, January, 2002

LSI Logic Corp., a leader in semiconductor packaging solutions, and Siliconware Precision Industries, Ltd., a worldwide IC assembly, test and design provider, have announced a licensing agreement in which SPIL will license LSI Logic's organic laminate flip chip ball grid array (FPBGA) technology.

The licensing agreement provides SPIL with access to the following LSI Logic packaging technologies: FPBGA-4L (four layer), FPBGA-HP (high performance) and flxI/O(tm) flip chip. flxI/O, LSI Logic's newest packaging family, offers area array I/O placement, enhanced electrical and thermal performance and die size optimization. The agreement also includes assembly processes and materials for the manufacture and qualification of each package type, use of LSI Logic's...

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