Technology Industry
Industry: Email Alert RSS FeedHoneywell offers new Hole Fill Process. (Up Front Industry News & Insight).(Brief Article)(Product Announcement)
Electronic Packaging & Production, April, 2002
Honeywell Advanced Circuits (HAC) has developed a fabrication process and equipment it says is simple in design, yet delivers high-aspect ratio hole-fill capabilities at throughputs consistent with volume production demands.
According to Honeywell, a patent is pending for the FulFill Hole Fill Process, and HAC has launched a service bureau offering the technology.
"To meet critical customer needs for increased board density and thermal management, we have developed unique capabilities and skill in filling high-aspect vias," according to Brad Morton, HAC VP and GM of Honeywell Advanced Circuits. "This technology provides an opportunity for us to work directly with other PCB suppliers to meet our customers' production needs as the technology is...
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