Swift acoustic inspection rescues BGAs. (Case in Point).

Electronic Packaging & Production, October, 2002

When a contract manufacturer discovers that the heat of the reflow process is causing damage to IC packages, the hunt begins for the root cause of the problem -- which could be in any of numerous earlier process steps. In the case of the damage occurring at an Asia contract manufacturer, the unknown cause of the problem seemed to originate with the maker of the plastic BGAs. The maker of the BGAs examined its processes and soon learned that the problem consisted of delaminations in the BT substrate. The BT substrate, in turn, was being supplied by a third company. The very thin delaminations, it was found, were present in the BT substrate when delivered by the vendor to the BOA maker

After encapsulation of the BOA by the manufacturer, the moisture that...

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