Researchers cool hot silicon chips with water. (Industry News & Insight).(Brief Article)

Electronic Packaging & Production, October, 2002

Researchers at the UCLA engineering school are coaxing more efficiency out of hot silicon chips by spraying them with water. The technology has numerous applications including improving the efficiency of the communications platform aboard unmanned aircraft and the performance of electric car and train motors.

Maintaining lower operating temperatures allows transistors to be driven harder, causing them to produce more power. It also allows chips to survive in harsh temperature environments that would otherwise cause them to fail. Researchers found that liquid spray-cooling could improve the performance of transistors as much as 34 percent. While there are commercially available products that spray-cool the entire package of components, including the circuit boards...

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