Kester introduces no clean paste. (Soldering Technologies Special Section).

Electronic Packaging & Production, March, 2003

Northrop Grumman Corp. has introduced PureMark 202, a no-clean solder paste by Kester, a business unit on Northrop Grumman's component technologies sector. The all-purpose, no-clean solder paste is reportedly the first in the marketplace with in-circuit-test (ICT) pin-probe-able residues that can also print to 0201s. It has an exceptionally broad reflow profile window, easily penetrable flux residues, and consistently clean stencil release, for critical fine-pitched applications down to 0.4mm/16 mils. Its anti-slump and solder print deposit definition characteristics are constant with varying print speeds of up to 8 in./sec or 200 mm/sec. Its dependable print quality remains strong even with extended down times of up to 120 minutes.

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