Tessera introduces Pyxis packaging. (Up Front).

Electronic Packaging & Production, June, 2003

Signaling a new era in semiconductor packaging for cellular phones and wireless electronic products, Tessera Inc. unveiled the Pyxis platform, reportedly the world's first chip scale packaging technology for highly integrated radio frequency (RF) modules. This breakthrough packaging technology integrates RF devices with their surrounding circuitry while delivering unprecedented cost, height and area savings for more feature-rich, lowcost wireless electronic products.

Pyxis overcomes the size, reliability, performance, thermal and noise isolation challenges currently impeding higher levels of RF integration. To provide a clear path to mainstream adoption, it leverages existing CSP and flip chip manufacturing processes and established infrastructure.

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