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Articles in March, 1989 issue of EDN

• Standard parts spring from QML program. (Qualified Manufacturing Line)
  by Russell, John
• Government must commit to product development, says IEEE: conference declares antitrust laws and trade policies need revision.
  by Colborn, Kate
• Call for software engineers: familiarity with IC design tools is tops on VLSI Technology's wish list.
  by Rawson, Bob
• Local distributor holds its own among top 50: Wisconsin distributor preserves independence in era of mergers and consolidations. (Milwaukee's Marsh Electronics Inc.) (company profile)
  by Rooney, Paula
• Software programs ease circuit designer's task: RF-microwave CAE tools. (computer aided engineering) (technical)
  by Pryce, Dave
• EDN's advanced CMOS logic ground-bounce tests. (complimentary metal-oxide semiconductors) (includes related articles on EDN's test methods and on future ACL chip noise) (technical)
  by Shear, David
• Static column decode speeds up DRAM access time. (includes related article on designing a memory timer) (technical)
  by Peprah, Joshua
• Construct a low-cost 8096-family development system.
  by Horton, Eric P.
• PC-based precision counter offers high performance and low cost. (Guide Technology Inc.'s GT200 precision universal counter)
  by Conner, Doug
• Antialiasing filters reduce errors in A-D converters. (analog-to-digital converters in data-acquisition systems) (includes related article on the inviolable limits set by sampling theory) (technical)
  by Steer, Robert W., Jr.
• Where MIMIC goes from here. (Special Supplement on Military Electronics: RF and Microwave) (Microwave-Millimeter-Wave Monolithic IC program) (includes related articles on Defense Department research and the phases of MIMIC)
  by Cohen, Eliot D.
• HDTV prompts scattered hiring: while some companies will hire a few engineers, prospects are generally limited. (high-definition television)
  by Quinnell, Richard
• Smart cards are getting smarter faster.
  by Terry, Chris
• Plug-in power sources simplify system design.
  by Ormond, Tom
• Logic synthesis prepares for VHDL. (very-high-speed-integrated-circuit hardware description language) (technical)
  by Markowitz, Michael C.
• Processors for 3-D graphics. (PC-based three-dimensional graphics)
  by Conner, Margery S.
• Unix software moves toward standardization: Cadam ports CAE package to new platforms; other to shed proprietary approach. (computer-aided engineering)
  by Rooney, Paula
• Noyce deplore the selling of America: recent sales of wafer manufacturers leave capacity in German, Japanese hands. (Sematech CEO Robert N. Noyce)
  by Harbert, Tammi
• Rise in SMT uses poses challenges and opportunities: problems with contract assemblers delay product introductions. (includes related article on avoiding SMT problems) (surface-mount technology)
  by Rooney, Paula
• MIPS customers gain access to international second sources: licensing pact ensures worldwide manufacturing, marketing, and support for the MIPS RISC microprocessor. (MIPS Computer Systems) (product announcement)
  by Harbert, Tammi
• Follow simple rules to prevent material and assembly problems. (includes related article on looking for leakages) (technical)
  by Pease, Robert A.
• VHDL: VHSIC Hardware Description Language. (Special Report) (includes related article on VHSC hardware description language)
  by Leibson, Steven H.
• (Microprocessor) packs workstation power and graphics ability in 1M-transistor chip. (Intel's 80860)
  by Conner, Margery
• Plastic SMT package offers 524 leads. (surface-mount technology) (product announcement)
  by Quinnell, Richard
• Japanese doors open slowly to US component distributors: personal relationships, close ties to a Japanese firm, and patience are keys. (includes related article on forming Japanese alliances)
  by Rooney, Paula
• Job opportunities abound, but so do perils: your CEO and company culture can change during the typical 2-year stint overseas. (includes related article on sending engineers overseas)
  by Colborn, Kate
• Fourier technique lets microprocessors synthesize complex waveforms. (Design Feature)
  by Schugel, Lee J.
• Memories herald 3.3V logic supply: increases in density drive CMOS ICs to lower operating voltages. (Complementary Metal Oxide Semiconductor Integrated Circuits) (includes related article on experimenting with the 3.3V operating voltage) (product announce
  by Quinnell, Richard A.
• The two faces of semiconductors: as misfortune befalls some semiconductor companies, others can't find enough engineers. (includes related article on industry forecasters)
  by Stenzler-Centonze, Marjorie
• Intel's RISC: worth the wait? (64-bit chip executes up to three instructions per clock cycle) (reduced-instruction-set-computer) (product announcement)
  by Harbert, Tammi
• Unified European standards will simplify design process: but don't expect big changes or more stringent guidelines.
  by Leibowitz, Michael R.
• Are automated design tools fulfilling their promise? (Electro conference)
• Controlling a robot arm in C.
• Offline supply offers 7W -in(superscript 3): user-configurable power package replaces custom designs in a fraction of the space. (7 watt-cubic inch) (includes related articles on zero-switching and making the design fit) (product announcement)
  by Prager, Jay
• Panels debate IC technology's future: DRAMs may not remain technology driver, while memory management is key to microprocessors. (integrated circuits)
  by Clarke, Michele
• Miniaturization high on RF receiver development list. (Special Supplement on Military Electronics: RF and Microwave) (Radio Frequency)
  by Dexter, Charles
• Merger frenzy takes its toll: corporate survival tactics help engineers adapt to disruption.
  by Davis, Eileen
• Private developer vs federal government: retaining software rights requires vigilance.
  by Owen, Stephen T.
• RISC boards target real-time applications. (reduced instruction set computer CPUs)
  by Wright, Maury
• Hardware modeling system creates simulation models of your ASICs. (Logic Modeling Systems' LM-1000) (application-specific integrated circuits)
  by Markowitz, Michael C.
• 1M-bit DRAM packages follow trend toward surface-mounting. (includes related article on the use of single in-line memory modules as dynamic RAM subassemblies) (dynamic RAM)
  by Harbert, Tammi
• A look at current microwave CAE tools. (Special Supplement on Military Electronics: RF and Microwave) (computer-aided engineering)
  by Pitzalis, Octavius
• A mature industry returns to innovation: time measurement instruments. (technical)
  by Strassberg, Dan
• A state machine handles back-end processing for clustered networks. (includes related articles on CCITT recommendations and on how the PMC RAM affects action) (technical)
  by Bennett, Brian
• Electro-89. (design-electronics trade show and convention) (includes extensive product descriptions)
  by Quinnell, Richard A.
• Age discrimination still plagues older engineers; many years of experience may actually be detrimental to an EE's career. (includes related articles on how to deal with age discrimination) (electrical engineer)
  by Clogston, Ruth
• RISC processors replace registers with stacks: stack-based devices directly execute Forth and improve performance. (includes related article on RISC's next generation) (reduced instruction-set computers)
  by Quinnell, Richard A.
• Medical electronics melds technology and altruism: hiring outlook at most companies is healthy.
  by Stenzler-Centonze, Marjorie
• New York and Connecticut. (regional profile - electronic industry conditions)
  by Colborn, Kate
• Dynamic modes refine synchro-to-digital converter testing. (Design Feature) (includes related article on how a synchro-to-digital converter works)
  by Smith, Franklin W.
• AT&T and Intel form ISDN and LAN alliance. (local area networks) (technology agreements and acquisitions)
• Unraveling the intricacies of dynamic RAMs. (Designer's Guide: dynamic RAMs, Part 1) (includes related article on early- vs. delayed-write cycle) (technical)
  by Dreher, Carl T.
• Electromechanical relays survive despite competition: performance and reliability improve, though surface mounting lags. (includes related article on electromechanical vs. solid state and improving relays)
  by Magnus, Stephen A.
• RF-microwave developers need strong foundations. (Special Supplement on Military Electronics: RF and Microwave) (Radio Frequency) (includes related articles on product development and digital circuitry)
  by Clarke, Michele