Epoxy system approved for NASA low outgassing specs.(Packaging & Interconnects)

ECN-Electronic Component News, August, 2003

Master Bond epoxy system EP30LTE-LO featuring low shrinkage, high dimensional stability and an exceptionally low coefficient of thermal expansion has passed ASTM 595 for low outgassing. EP30LTE-LO is being used in applications requiring vacuum compatibility, sealant or encapsulant. The epoxy system offers an easy to use 10:1 mix ratio by weight with a room temperature cure. Additional properties include a CTE of 12 x [10.sup.-6] in/in per [degree]C; a linear shrinkage of 0.0002 in/in per [degree]C, thermal conductivity of approximately 6 BTU in/[ft.sup.2] hr per [degree]F and a wide service temperature range of -60[degree]F to 250[degree]F. EP30LTE-LO bonds to a wide variety of metals, plastics, ceramics and glass. Master Bond Inc., 154 Hobart St., Hackensack, NJ 07601;...

Premium Content Partnership | HighBeam Research provides an in-depth online archive library of reference works. HighBeam Research

 

BNET TalkbackShare your ideas and expertise on this topic

Please add your comment:

  1. You are currently: a Guest |
  2.  

Basic HTML tags that work in comments are: bold (<b></b>), italic (<i></i>), underline (<u></u>), and hyperlink (<a href></a)

advertisement
CXO UnpluggedSmart Business interviews on BNET

See and hear how senior level executives across the Asia Pacific are developing smart business ideas across a variety of sectors. The focus is on the future, and on how businesses need to evolve.

advertisement
  • Click Here
  • Click Here
  • Click Here
advertisement
Click Here