Qualified ASIC packaging capability.(Integrated Circuits & Semiconductors)

ECN-Electronic Component News, May, 2005

Aeroflex has announced qualification of its RadHard ASIC packaging capability for desirable SSO (simultaneous switching output) response. An external chip capacitor attachment is available for UT0.05 [micro]n RadHardASICs and FPGA-to-ASIC conversions. The chip capacitor attachment meets space quality levels. SSO can result in noise spikes on ASICs causing glitches and timing push-out of signal nets. By adding the chip capacitor directly to the packages, additional "local" decoupling capacitance is available to mitigate current surges during SSO events so signals generating from the ASICs are not affected by the noise spikes. Aeroflex

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For more information enter InfoLINK 124-50503-127 at www.ECNmag.com or call 800-441-6180

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