New process technology for Circuit Under Pad (CUP) wafer testing.(Test & Measurement)

ECN-Electronic Component News, September, 2005

Kulicke & Soffa Industries, Inc. has developed two new epoxy probe card process technologies that are said to help solve the challenges posed by Circuit Under Pad (CUP) devices during wafer testing. These process technologies work together to offer shallower scrubs using light pressure to avoid cracking underlying pad structures, which is one of the major challenges in today's wafer test process. Kulicke & Soffa Scrub Optimization design process ensures that the smallest, most consistent scrubs are achieved on an epoxy probe card. Using Finite Element Modeling, the Scrub Optimization technique can ensure probe scrubs properly with minimal contact force. When combined with the DuraPlus[TM] Fine-Pitch Epoxy Probe Card Technology, Scrub Optimization and RC Probes have been...

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