Printed Circuit Design & Manufacture

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Articles in April, 2009 issue of Printed Circuit Design & Manufacture

• Altium turns a first-half profit
• OM Group posts Q4 losses
• Patent spoils
  by Kathy Nargi-Toth
• Nothing in storage
• Manufacturing contracts in February
• Smartphone shipments to rise 11% this year
• CEA: consumers remain 'anxious'
• China's auto electronics slowing down
• Industry market snapshot
• Mentor's Q4 profits down 15%
• Cal to PC makers: cut your emissions
• PCB prices decline in 2009
• Report: IT to benefit from stimulus plan
• Japanese electronics workers demand pay hikes
• Singapore singing blues over electronics
• Semi market to plunge this year
• Foxconn and IBM to codevelop eco-friendly products
• France to enact stiff REACH penalties
• Camtek Q4 revenues tumble 41%
• January PCB bookings drop 29%
• Events
• RBP Chemical Technology Inc
• R&D Circuits
• Artetch Circuits Ltd
• Mark Gibson
• Enthone Inc
• Ucamco and Polar Instruments announced a link between the companies' software that will improve communication between CAM and engineering when dealing with complex PCB stackups
• Tapco Circuit Supply and Schmid Systems Inc. have entered into a distribution agreement
• Ggp-Schaltungen GmbH has received approval from Sartorius AG to supply Enthone OrmeSTAR Ultra nanofinish
• Marlo Electronics Inc. and Epec LLC. have partnered to provide a larger range of products and services
• Careful, not fearful: uncertainty is a big distracter, so keep staff focused on standard procedures and process controls to avoid costly mistakes
  by Peter Bigelow
• Designated solderability preservative: the judgment on what defines an ideal PCB surface finish varies greatly depending on the vantage point of the judge
  by John Swanson
• PCB stackup analysis and design, Part 4: when designing a PCB stackup, get the fabricator involved
  by Abe "Abbas" Riazi
• The lead-free microvia challenge: to identify weak microvias with the potential for field failure, IST test temperatures need to be increased and cycling extended to failure
  by Paul Reid
• Opening eyes on fiber weave and CAF: new glass fabrics reduce glass weave to signal line interaction and help designers meet tighter skew specifications for high-speed systems
  by Russell Dudek
• Near-term opportunities for large-area flexible electronics: photovoltaics, displays and sensors could lead an industry revolution
  by Daniel Gamota
• Concurrent RF/microwave PCB design: when RF and PCB design teams co-design as equals, the design can meet performance goals in less time
  by Michael C. Heimlich
• Designing with microBGAs: microBGAs provide electrical and physical advantages at the cost of increased design and manufacturing complexity
  by Ishtiaq Safdar
• New opportunities in electronics manufacturing: MEMS, HDI, embedded passives and LEDs present a sea change in the way boards are designed and built, and could shift the market back to the West
  by Matthew Holzmann
• Processing high frequency materials, Part 2: PCB fabricators can increase yields and improve product reliably by understanding the distinct process requirements of high frequency materials
  by John Coonrod
• UHM socket connector
• Nanocleen advanced particle removal system
• Board Modeler collaborative software tool
• Waste treatment products
• Thermally conducive tape
• OrmeSTAR Ultra organic nanofish
• Embedded chip manufacturing
• Wireless sensor system
• Compact horizontal develop, ETCH & strip line
• Managing power, a business perspective: complex power distribution network design requires accurate analysis tools that are useable by engineers close to the PCB layout process
  by Henry Potts