Printed Circuit Design & Manufacture

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Articles in June, 2009 issue of Printed Circuit Design & Manufacture

• China's exports drop in March
• Positive energy
  by Kathy Nargi-Toth
• Defenses down
• Manufacturing orders gaining
• US manufacturing still finding bottom
• Auto electronics hits brakes
• Industry market snapshot
• Weak start for German PCB market
• No votes force changes to J-STD-709
• PCB East sells out in Beantown
• North America's PCB shipments continue to decline
• Wurth to shutter Pforzheim facility
• Cadence Q1 better than expected
• Orbotech Q1 revenues down 9%
• Singapore rebounds in April
• TTM Q1 profits up
• Fabs press DoD on PCB policy
• EDAC investigates software piracy
• Events
• Mentor Graphics Corp. has acquired LogicVision Inc. in a deal valued at about $13 million, expanding its IC product portfolio
• Polyclad Laminates Inc., a subsidiary of Isola Group, renewed a license agreement with Nan Ya Plastics Corp. for Drum Side Treated Foil technology
• Harbor Electronics
• Schweizer Electronic AG and Meiko Electronics have partnered to provide customer support, production and technology development
• Mentor Graphics Corp
• IEEE Design Automation Technical Committee
• Cicor Technologies
• HMS Hollmuller
• Innovex Inc
• Treasure hunt: in times of uncertainty, resources like time and talent can be game changing
  by Peter Bigelow
• Plating anomalies and defects, Part 1: plating defects can have multiple origins, so don't jump to conclusions
  by Michael Carano
• PCB stackup analysis and design, Part 5: PCB stackup influences board impedance, signal integrity and the EMI performance of the system
  by Abe "Abbas" Riazi
• OSP for lead-free assembly: opening screen apertures to cover the entire pad can overcome incomplete solder spread experienced with OSPs in lead-free assembly applications
  by George Milad
• A solar cell primer for the PCB industry: manufacturing methods, like screen-printed paste, are giving way to photolithography, inkier deposition and plating, as solar cell manufacturing techniques evolve
  by Don Cullen
• Improving via design for high data rate applications: controlling via impedance and minimizing reflection are important when designing via structures because via-hole transitions are a major contributor to signal degradation
  by Yuriy Shlepnev
• PCB fabrication suppliers' spotlight: throughout the PCB supply chain, companies continue to invest in R&D to meet the changing market requirements
  by Kathy Nargi-Toth
• Improving the multilayer PTFE fabrication process: good drilling and registration are critical to the success of microwave designs because embedded filters and couplers can be adversely affected by poor hole quality and misregistration
  by Thomas F. McCarthy; Oliver Zhu; Anthony Serafino; Brigitte Lawrence
• Improving dry film lamination yields: maintaining the correct, uniform pressure in the lamination process can increase yields by reducing opens and eliminating dry film wrinkles
  by Jeffrey G. Stark; Karl H. Dietz
• Advantages of isotropic PCB routing: isotropic routing systems can help reduce the total wire length by 25% to 40%, while reducing the number of vias
  by Sergey Luzin; Oleg Polubasov
• Fan-out strategies for fine-pitch BGAs: working together, PCB designers and fabricators can explore manufacturing techniques that optimize designs, reduce routing layers and minimize PCB costs
  by Ishtiaq Safdar; Syed Wasif Ali
• Thermal management tool
• Mechatronic modeling tool
• I/O connectors
• Data input and analysis tool
• Interactive gap fill tool
• Thermally stable bonding material
• EDA migration software
• Non-silicone thermal gap filler
• Decoder IP solution
• Design for continuous improvement: augmenting DfM and DfA with predictive first-pass yield analysis offers a comprehensive view of manufacturing performance
  by Mark Laing