Business Services Industry
Tyco Electronics Corp.: Micro Interconnect System. (New Products).(AMPMODU Micro Interconnect System)(Brief Article)(Product Announcement)
Wireless Design & Development, May, 2002
The AMPMODU Micro Interconnect System is based on high-density 0.8 mm centerline contacts. It is designed for cable-to-board, cable-to-cable, and board-to-board applications. The AMPMODU Micro Interconnect system is a dual row connector and is available in 4 through 40 positions. An "F" crimp for 28 AWG wire provides wire termination. Contacts terminated to 28 AWG wire are rated at 1 amp. The temperature rating is -40[degrees]C to 85[degrees]C.
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