Wireless Design & Development

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Articles in February, 2005 issue of Wireless Design & Development

• Power solutions guide.(Books & CDs)
• RF transceiver.(Subsystems)
• LNA Module.(Military/Aerospace)
• TC-OCXO technology.(temperature-compensated oven-controlled crystal oscillators)(Brief Article)
• A/D converter.(Technology focus: digital technologies)(Brief Article)
• Richardson's Interconnect Group signs distribution agreement with Fractus.(Brief Article)
• Elcoteq and Thomson enter outsourcing agreement.(Brief Article)
• Development tools.(ZigBee-Ready Signal Generator)(Brief Article)
• Product Selection Guide.(Books & CDs)
• Chip fuses.(Passives)
• Sensor development kit.(Cypress Semiconductor CY3635)(Brief Article)
• Coaxial isolator.(Transmission Components)(Brief Article)
• Digital attenuators.(Technology focus: digital technologies)(Brief Article)
• Connor-Winfield purchases AG Communication's manufacturing facility and assets.(Brief Article)
• Semiconductor to power its next generation of SoC.(embedded systems)(Brief Article)
• Multimedia processor.(Adimos ADM100)(Brief Article)
• Test and Measurement Catalog.(Books & CDs)
• GPS controller.(Subsystems)
• Reference methodology.(Agilent 93000 SmarTest Program Generator, Synopsys TetraMAXa)(Brief Article)
• Digitally tuned VCXO.(Cardinal Components VCXO)(Brief Article)
• Tackling heavyweight DSP design at application levels: by innovating at a higher level of abstraction, DSP designers not only can meet their system performance requirements but also can reduce power consumption, minimize product cost, shorten product deve
  by Price, Tony Curzon
• Spectrum delivers development platforms to US defense contractor.(SDR-3000 MRDP )(Brief Article)
• Australian government supports Mimix Broadband's collaborative research.(Brief Article)
• Portable antenna.(What's Hot)
• Embedded systems literature.(Books & CDs)
• Surface mount resistor.(Passives)
• Array antenna module.(Micro-Ant PCA15SR)(Brief Article)
• Flange mount drop-in isolator.(Transmission Components)(Brief Article)
• Asymmetric multiprocessing.(Technology focus: digital technologies)(Brief Article)
• Cardinal Components announces partnership.(with Dependable Component Supply)(Brief Article)
• Merrimac reports transfer of stock.(Brief Article)
• WiMAX baseband chip.(Wavesat Inc DM256)(Brief Article)
• Microwave components.(Books & CDs)
• Smart card IC.(Subsystems)
• Mobile radio tester.(Test & Measurement)
• Coaxial resonator VCO.(Z-Communications CRO2645A)(Brief Article)
• DC/DC converters: the DMW series.(Technology focus: digital technologies)(Brief Article)
• XEMICS SA launches Hong Kong branch office.(Brief Article)
• Ember and Mototech to offer design and manufacturing services.(Brief Article)
• SMA connectors.(ISOTEC )(Brief Article)
• Shortform Catalog.(Books & CDs)
• RFIC products.(Subsystems)
• PCB software.(Test & Measurement)
• Silicon oscillator.(Linear Technology LTC6905)(Brief Article)
• CESoP and Wi-Fi--the perfect marriage? CESoP and Wi-Fi is emerging as an attractive alternative to carry TDM traffic over the PSN.(Featured Technology)
  by Lang, Tao
• ZigBee for wireless apps: low-power, low-cost, and robust ZigBee hardware is beginning to show up in the marketplace.(Technology focus: digital technologies)
• InterDigital enters agreement with General Dynamics.(Brief Article)
• $4M million financing round.(TeleCIS Wireless Inc.)(Brief Article)
• Multilayer cofired ceramic design guide.(Books & CDs)
• VME board.(Digital Hardware)
• Design kit.(for Agilent Technologies' Advanced Design System )(Brief Article)
• Directional antenna.(Pacific Wireless MD24-12)(Brief Article)
• DC/DC converters.(Technology focus: digital technologies)(Brief Article)
• Austriamicrosystems and Nu Horizons announce distribution partnership agreement.(Brief Article)
• Eagleware purchases Elanix.(software indusdtry)(Brief Article)
• Single-chip all-CMOS MBOA UWB chip.(What's Hot)
• Instrument Selection Guide.(Books & CDs)
• Power amplifier.(Amplifiers)
• Test solution.(Test & Measurement)
• Frequency mixers.(Mini-Circuits MCA1, low temperature cofired ceramic frequency mixers)(Brief Article)
• Incremental redundancy in EGPRS: incremental redundancy is implemented in EGPRS systems to achieve maximum efficiency in over-the-air interface. By using incremental redundancy, error correction data is not sent over the air unless the data is received in
  by Mercy, Paul
• IF interface module.(intermediate frequency interface module)(Brief Article)
• Henkel announces opening of Research and Applications Center.(Brief Article)
• Wavesat announces partnership with EDOM.(EDOM Technology Company Ltd.)(Brief Article)
• Forecasting ... a tricky business.(Column)
  by Worthman, Ernest
• Broadband wireless modem.(new product from Provigent Inc.)
• Charge pumps.(Semiconductors/ICs)
• Spectrum analyzer.(Test & Measurement)
• Wireless development platform.(Brief Article)
• Switch filter bank.(Lorch Microwave 6IFA-203/234-SR)(Brief Article)
• A/D converter.(Technology focus: digital technologies)(Brief Article)
• BFi OPTiLAS and XMA sign distribution agreement.(Brief Article)
• TeleCIS wireless completes Atmel and Thales Navigation sign technology agreement.(Brief Article)
• Solid switch matrix.(Brief Article)
• New product brochure.(Books & CDs)
• Low noise amplifiers.(Amplifiers)
• Logic analysis system.(Test & Measurement)
• Development kit.(Microchip Technology PICDEM Z 2.4 GHz demonstration kit)(Brief Article)
• Wireless base station design using platform FPGAs: as predictions for infrastructure cost forecast a maturing of the industry, the demand will be for lower costs and increased functionality. Platform FPGAs are rising to the occasion, and offer new opportu
  by Miller, Andy; Gamba, David
• Microcontrollers.(ZiLOG Crimzon ZLR32300)(Brief Article)

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