Bibliography for: "Justin Testa"

"Justin Testa". Circuits Assembly. FindArticles.com. 15 Dec, 2009. http://findarticles.com/p/articles/mi_hb5118/is_6_19/ai_n29442723/

Circuits Assembly

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Articles in June, 2008 issue of Circuits Assembly

• CE sales to rise 10% this year
  by Chelsey Drysdale
• Black pad has multiple causes
  by Don Walsh
• Corrections
• Spin cycle
  by Mike Buetow
• Dai Nikko Engineering
• Rehm Thermal Systems
• Electrolube
• Phoenix X-Ray
• Hunter Technology
• Cookson Electronics
• Distron Corp
• Zollner Group
• Milara Inc
• Valor Computerized Systems
• Electronic Systems Inc
• Flex Interconnect Technologies'
• Brian Lau
• Rick Gour
• Mike Splain
• Tony Ge
• Mark Kohler
• Emilio Stornaiuolo
• Mark Brainard
• John Macrina
• Daniel Casacci
• Tiow Ping Sim
• Michael Burgess
• Peter Hoctor
• Sherwin Kobak
• Justin Testa
• Steve Pudles
• RoHS exemptions input released
  by Mike Buetow
• Cal urged to back down on chemicals ban
  by Mike Buetow
• NPL devises Pb-free alloy tester
  by Chelsey Drydale
• 'Lack of Martha Stewarts' slowing XRF acceptance
  by Mike Buetow
• iNEMI seeks to resolve Pb-free Alloy, failure issues
  by Mike Buetow
• Raby: 'PTH, not transistor, greatest invention'
  by Chelsey Drysdale
• A/V recovery
  by Chelsey Drysdale
• April PMI a mixed bag
  by Chelsey Drysdale
• Industry Market Snapshot
  by Chelsey Drysdale
• Printed electronics to hit $300B by 2028
  by Chesley Drysdale
• TFI lowers EMS outlook
  by Chelsey Drysdale
• Metals index
  by Chelsey Drysdale
• 'We have to make it relevant'
  by Haley Fu
• Correlating 2-D and 3-D SPI; As pads get smaller, the correlation between the various area measurements weakens
• The China syndrome; Mere mention of it can set people off, but there's reason to be wary
• China goes 'upmarket'; IP theft remains an issue, but business rolls on in Shanghai
  by Mike Buetow
• Out of the garage; How a northern Utah-based EMS firm is turning Cache Valley into cash Valley
  by Mike Buetow
• Improving production line performance
  by Dr. Sabry Shaaban
• Manufacturing steps onto the enterprise IT stage Disparate software tool proliferation begs for an integrated solution
  by Jason Spera
• Measuring and controlling wave height and dwell time: a direct measurement, closed-loop system is effective for regulating critical parameters
  by Ken Kirby
• What have we learned about copper dissolution? Pull testing reveals large differences between alloys
• The SAC-SnPb dilemma: when can SAC-finished parts be soldered with SnPb solder?
• The boundary scan buzz at Apex: new products are leveraging existing technologies - and receiving much broader adoption
• What is 'reliably' clean? Quick analytical tests can produce reliable conclusions on surface cleanliness
• Fab workarounds, part 2: More tips and tricks to help assemblers in a pinch
• Dfx for Lean, Part II
• Small die size adhesives
• High-speed die sorter
• Tabletop pick, place and dispenser
• 25-[micro]m die attach coater
• Die attach materials
• Wafer temperature profiler
• Batch and inline water cleaner
• Oblique angle inspection
• PCB terminal block
• 'Auto-planarity' bonder
• Benchtop plasma cleaner
• Mid-volume printer
• 'No test points' ICT
• Low power reflow
• 'No CAD' line transfer tool
• 1 or 2-gantry flexible placement
• XRF analysis tools
• Combo planning, analytic software
• High-volume pick-and-place
• Programmable preheater
• Vapor phase rework station
• '1% dry' cabinet models
• Wave height monitor

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