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Chelsey Drysdale "Manufacturing orders gaining; biggest jump in 2 quarters". Circuits Assembly. FindArticles.com. 02 Jan, 2010. http://findarticles.com/p/articles/mi_hb5118/is_6_20/ai_n32072973/
Circuits Assembly
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Articles in June, 2009 issue of Circuits Assembly
-
A show of hands
by Mike Buetow - Oracle
- Verigy has restructured its global manufacturing services deal with Jabil Circuit
- Zollner Elektronik
- Universal Instruments Corp
- Essemtec
- Hexi Electronic Equipment named Blakell Europlacer
- Koh Young Technology
- TT Electronics
- Zollner Elektronik has installed Juki
- DEK named Prodelec
- Foxconn
- Elite Electronics Systems and CT Production have placed orders for Europlacer's
- Essemtec Switzerland named PMTech Ltd
- Aqueous Technologies named as distributors 3S Technologies in Turkey
- Data I/O named as sales representatives Kirby & Demarest
-
'No' votes force changes to J-STD-709
by Mike Buetow -
Fabs press DoD on PWB policy
by Mike Buetow -
Embedded passives on thick-film substrates could be precursor to printed flex circuits
by Mike Buetow -
Foxconn fire won't affect supply
by Mike Buetow -
Celestica CEO: acquisitions possible
by Mike Buetow -
Micronic to acquire Mydata in all-stock deal
by Mike Buetow -
Nepcon Rx for local companies' business
by Mike Buetow - Key Tronic Corp
- Tom Gebhardt
- Harald Eppinger
- Craig Arcuri
- Jim Good
- Drew Richmond
- John H. Buckley
- Robert Mihalyi
-
Defenses down
by Chelsey Drysdale -
Manufacturing orders gaining; biggest jump in 2 quarters
by Chelsey Drysdale -
Industry market snapshot
by Chelsey Drysdale -
US Mfg. Still finding bottom
by Chelsey Drysdale -
Auto electronics hits brakes
by Chelsey Drysdale -
Large-area TFT LCD shipments grew 29% in March
by Chelsey Drysdale -
Metals index
by Chelsey Drysdale -
Bottle up the Wrath: given the extraordinary cost to flip EMS suppliers, it's best to check your anger at the door
by Jennifer Read -
Have it your way: designing in flexibility isn't easy, but it's a must
by Clive Ashmore -
Survival of the fittest? On the permanent hunting for efficiency
by Peter Grundy -
What we can learn from Singapore: the city-state's focus on business growth and addressing niche market needs creates a robust supply chain
by Susan Mucha -
BGA reballing reliability: a study of multiple reball processes looks at copper dissolution and functionality
by Ray Cirimele -
Cell efficiency is key to success of photovoltaics: the iNEMI roadmap spells out the plan for lowest cost per watt
by Alain Harrus; Jim Handy -
On the use of three thermocouples to verify a PCB profile during reflow: evidence shows tight specifications on the two response variables for the temperature profiles can do the trick
by Daryl L. Santos; Arun Ramasubramanian; Laurence A. Harvilchuck -
Navigating AOI for low-volume, high-mix users: a series of companies describe how they use inspection
by Stacy Kalisz Johnson - Wedge bonding tools for fine-pitch applications: connecting leads to die involves precise tool selection
-
A look at preheating systems: the three main preheater types each have specific strengths
by Ursula Marquez de Tino -
Insufficient solder bottom-side fillets: when these defects occur, check the flux and conveyor speed
by Paul Lotosky -
Preventing contamination caused assembly failure: SIR must be designed for, especially in high-frequency boards
by Harald Wack -
Flux shorts on BGAs: cleaning can actually exacerbate flux shorts; x-ray first!
by Davide Di Maio - 3-line placement platform
- Blind mating hinged PowerStrip
- Halide-free, Pb-free solder paste
- 'Plug-and-play heads' assembly machine
- Optical-aligning selective soldering
- PCB post-processing tools
- Fiber laser markers
- Precision linear shafts
- Process equipment board support
- 4-color AOI
- 'Sharp spread' all-Sn Solder Wire
- Digital ICT
- Automated prototype pick-and-place
- Dross separating powder
- Benchtop modular rework
- Rose ionic contamination tester
- 1-step clamping
- 16-site test handler
- Accela squeegee line
- Low-linting wipes
- 2-Lane convection soldering
- Stamp soldering under [N.sub.2]
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