Bibliography for: "ABCs of price vs. value: what first-graders can't tell you about cost of ownership"

Chrys Shea "ABCs of price vs. value: what first-graders can't tell you about cost of ownership". Circuits Assembly. FindArticles.com. 11 Dec, 2009. http://findarticles.com/p/articles/mi_hb5118/is_8_19/ai_n29457492/

Circuits Assembly

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Articles in August, 2008 issue of Circuits Assembly

• Dynamic duo teams again
  by Mike Buetow
• Cobar Europe
• Molex Inc
• Zestron America
• Kester named Cluff & Associates
• Fine Line Stencil
• Indium Corp
• Jabil Circuit
• Zollner
• Austin American Technology
• Lord Corp
• A-Laser
• Mirtec Co. Ltd
• BPM Microsystems
• Lenthor Engineering
• Valor Computerized Systems
• EMS firm Assel selected Valor's
• Photo Stencil
• Robert Willett
• Steven DiMarco
• Bhawnesh Mathur
• Lauro Montalvo
• Michael Greenlee
• T. Scott Hatton
• Geraint Anderson
• Warren Mitchell
• Greg Hayes
• Doug Burkhardt
• Jim Yeager
• John Anderson
• Tim Kardish
• Dynasil acquires RMD in $20M deal
  by Mike Buetow
• Right recipe can cut Pb-Free PCB costs
  by Chelsey Drysdale
• St.pete ok's package to keep Jabil
  by Mike Buetow
• Henkel, Shanghai University form electronics analysis Center
  by Chelsey Drysdale
• Private investment group purchases SCS
  by Chelsey Drysdale
• Catalyst acquires Ramp Industries
  by Mike Buetow
• Silicon forest growing capacity
  by Mike Buetow
• Building blocked: Lego pulls flex deal
• Elcoteq halts sale of Russian unit to Flextronics
  by Chelsey Drysdale
• Nihon Superior upgrades Singapore to regional HQ
  by Chelsey Drysdale
• Semis Drop by Half
  by Chelsey Drysdale
• June PMI above 50%
  by Chelsey Drysdale
• Industry market snapshot
  by Chelsey Drysdale
• Metals index
• Q2 Global PC shipments up 16% YoY
  by Chelsey Drysdale
• Execs bullish on US mfg
  by Chelsey Drysdale
• World growth rates slowing
  by Chelsey Drysdale
• An rx for growth
  by Chelsey Drysdale
• It's not all about miniaturization: processing large boards means thinking big
• The underappreciated manufacturers' Rep: Be kind to the rep. They are vital to the chain
• Auditing a fabricator: guidelines for prototypes and production boards overlap, but for offshore production the rule is caveat emptor
  by Zulki Khan
• Cutting machine programming time: How a novel process can avoid repeated online debugging
  by Edward Faranda
• Simultaneous acoustic imaging and surface mapping: combining the methods reveals not only the anomaly, but the extent of 3-D distortion
  by Tom Adams
• Stop the HOP; When HOP failures pop up, review the reflow profile
• Problems in the mix: why lead and Pb-free are often an unhappy marriage
• How clean must bare boards be? The fabrication process is a prime source of contaminants
  by Terry Munson
• ABCs of price vs. value: what first-graders can't tell you about cost of ownership
  by Chrys Shea
• Faster throughput through reliability analysis: Thorough reliability analysis helps minimize process variability
• Molex's Solder Charge interface
• 3-D laser scanning microscope
• Electroformed ni squeegee blades
• Enterprise monitoring dashboards
• Placement machine with dispensing head
• 3-head high-speed dispenser
• Vacuum component pickup
• 120-feeder placement machine
• Dipping paste for PoP devices
• RTV coater and dispenser
• Low-dross Pb-free alloy
• Cable-to-board interconnect
• Single-axis actuators
• Higher accuracy printer platform
• Pb-free wire
• Stainless steel lifting pins
• Handheld ID readers
• Laser-cut stencils
• Die-attach solder paste
• Hot melt packaging adhesives
• "Package-on-package warpage-impact on surface mount yields and board level reliability"
  by Niranjan Vijayaragavan

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