INSIDE Contactless Presents Next Generation NFC Services At 3gsm World Congress, Barcelona; Leading contactless technologies and partners enable unparallel telecommunications services, demoed on booth F33, hall 2, 12-15 February, 2007.

0 Comments | M2 Presswire, February, 2007

M2 PRESSWIRE-12 February 2007-INSIDE Contactless: INSIDE Contactless Presents Next Generation NFC Services At 3gsm World Congress, Barcelona; Leading contactless technologies and partners enable unparallel telecommunications services, demoed on booth F33, hall 2, 12-15 February, 2007(C)1994-2007 M2 COMMUNICATIONS LTD RDATE:12022007 Barcelona, Spain - INSIDE Contactless, a world leader for contactless semiconductor chips and hardware platforms, today announced that the company will present its next generation NFC (Near Field Communications) technologies and services on 3GSM booth number F33.

With over 10 years experience pioneering the emerging contactless payment market as a fabless semiconductor company, INSIDE Contactless currently holds more than 55...

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