Manufacturing Industry
Low-dielectric polymers speed integrated circuits.
Advanced Materials & Processes, November, 2001
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Polymers with ultra-low dielectric constants that would enable higher-density circuit designs have been reported by the Air Force Research Laboratory Materials and Manufacturing Directorate, Wright Patterson Air Force Base, Ohio. Low dielectric materials are necessary for greater circuit density, which results in reduced inter-element capacitance.
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The materials should greatly improve high-speed integrated circuits, and maintain high thermal stability and ease of processing. Degradation temperature is higher than 400[degrees]C (750[degrees]F), with a glass transition temperature ...
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