Manufacturing Industry
Thermal activation process enables ultra-thin layers. (Forming/Processing).
Advanced Materials & Processes, February, 2002
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A thermal activation process that enables transfer of ultra-thin silicon layers from a monolithic piece of silicon onto a new substrate has reportedly been developed by Soitec, France. Designated Smart Cut, the technology is said to offer better control than conventional methods such as eptiaxial lift-off, and a single substrate can be re-used many times for further layer transfers.
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Smart Cut allows the buildup of ...
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