Manufacturing Industry
Copper pin with solder tip allows flexible interconnects. (Welding/Joining).
Advanced Materials & Processes, September, 2002
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A surface mount interconnect technology, known as Solderball Pin, which provides greater flexibility and automation capability than conventional through-hole pins, has been developed by Autosplice Inc., San Diego, Calif. Designed with a high conductivity copper peg on one end and a solderball on the other, the pins can be efficiently inserted into the daughter-card printed circuit board (PCB).
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This is then placed onto the motherboard PCB, and is reflow soldered via conventional processes. A tapered peg design ...
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