Manufacturing Industry
Detection system measures strength of chip connections. (Welding/Joining).
Advanced Materials & Processes, December, 2002
A laser-ultrasonic bond detection system that measures the strength of tiny connections between microchips and their circuits has reportedly been developed by Simpex Technologies Inc., Brea, Calif., in collaboration with the Idaho National Engineering and Environmental Laboratory, Idaho Falls; the National Institute of Standards and Technology, Gaithersburg, Md.; and the Johns Hopkins University Applied Physics Laboratory, Baltimore, Md.
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The Laser Ultrasonic Bond Detection System combines a broad spectrum of technologies including custom optics, structured illumination, image ...
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