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Heat conductive compound encapsulates voice coil motor. (Materials Progress: Polymers/Ceramics).
Advanced Materials & Processes, February, 2003
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Caption: A thermally conductive compound has been chosen to encapsulate voice coil motors (1/CM) in hard disk drives, reports LNP Plastics, a GE Plastics Company in Exton, Pa. The LNP Konduit compound is a 55% ceramic-filled, 10% glass-filled polyphenylene sulfide-based (PPS) resin with a thermal conductivity of 1 W/mK, about three times the conductivity of unfilled PPS.
The material ...
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