Thermal paste minimizes heat buildup in electronic devices.(Welding/Joining)

Advanced Materials & Processes, October, 2003

A thermally conductive paste that may help solve the problem of overheating in high-performance computers and other electronic devices has been developed at the University at Buffalo, N.Y. When applied between a heat sink and a heat source, the paste greatly improves the conductivity of heat from the heat source to the heat sink.

The thermal paste is composed of carbon-filled organic material. According to inventor Prof. Deborah Chung, "The material is superior to all other thermal pastes, including those involving exotic materials such as carbon nanotubes and diamond. It even significantly surpasses solder, the best material currently available, for improving the thermal contact between two surfaces." The material is inexpensive to produce and it also is...