Thick copper inks improve adhesion and solderability.(Welding/Joining)

Advanced Materials & Processes,  January, 2004  

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Lead-free and cadmium-free thick print copper inks optimized for emerging automotive electronic systems have been introduced by Ferro Electronic Material Systems, Vista, Calif. These systems require conductors with higher power-handling characteristics and stability at higher temperatures. The lead-free and cadmium-free thick film copper pastes offer a firing range of 650 to 850[degrees]C (1200 to 1560[degrees]F), wide enough to cover the full range of emerging applications.

The automotive industry requires thick film electronic systems with thicker and narrower ...

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