Manufacturing Industry
Aluminum matrix composite solves heat problem in chips.(METALS)
Advanced Materials & Processes, September, 2005
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Aluminum/silicon carbide (AlSiC) metal matrix composite materials and products that have high thermal conductivity and controlled thermal expansion have been designed for electronic packaging applications, reports CPS Corp., Boston, Mass. The coefficient of thermal expansion (CTE) of the AlSiC composite is controlled and can be modified by changing the ratio of aluminum matrix to silicon carbide particulate.
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The AlSiC metal matrix thermal conductivity and weight are similar to that of aluminum, with controlled thermal expansion values that can be 33% to 50% that of aluminum. The ...
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