Lead-free solder discussed in new ASM publication.(WELDING/JOINING)

Advanced Materials & Processes,  November, 2005  

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Lead-Free Solder Interconnect Reliability, a new book from ASM International, provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. Edited by Dongkai Shangguan, the content has been written by leading experts working in this important technology area.

Both fundamental research and practical considerations are addressed. Many research projects around the world have been undertaken to study lead-free solder reliability under different loading conditions. The results of these studies have been reported rather sporadically at ...

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