Precision bonding joins tiny high-performance actuators.(WELDING/JOINING)

Advanced Materials & Processes,  December, 2005  

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Flat strips of bulk PZT, a commercially available piezoelectric material that shrinks slightly when a voltage is applied to it, and a precision micromachined silicon beam, have reportedly been bonded by low temperature wafer bonding techniques in a study at Pennsylvania State University, University Park.

The bonding process is based on photolithography and low-temperature solders to produce the distinctive bridge shape they need. A low-temperature solder bonding process at 200[degrees]C (390[degrees]F) was used in this work. [ILLUSTRATION OMITTED] The researchers fabricated ...

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