Manufacturing Industry
Precision bonding joins tiny high-performance actuators.(WELDING/JOINING)
Advanced Materials & Processes, December, 2005
Flat strips of bulk PZT, a commercially available piezoelectric material that shrinks slightly when a voltage is applied to it, and a precision micromachined silicon beam, have reportedly been bonded by low temperature wafer bonding techniques in a study at Pennsylvania State University, University Park.
The bonding process is based on photolithography and low-temperature solders to produce the distinctive bridge shape they need. A low-temperature solder bonding process at 200[degrees]C (390[degrees]F) was used in this work. [ILLUSTRATION OMITTED] The researchers fabricated actuators with dimensions ranging from 350 to 600 microns long, 50 to 100 microns wide, and 5 to 6 microns thick. The bonded materials form actuators in which PZT amplifies and converts...
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