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Heat-cycled lead-free solders resist tendency to brittleness.(PROCESS TECHNOLOGY)

Advanced Materials & Processes,  April, 2006  

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A tin-silver-copper alloy that offers a lower melting temperature and greater strength than other lead-free alternatives was patented in 1996 by the Ames Laboratory, Ames, Iowa. In addition to the tin-silver-copper alloy, modified alloys that also contain iron, cobalt, and other similar elements have been developed for higher-temperature applications.

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One ongoing problem with lead-free alternatives now available is a tendency to become brittle over time after repeated or prolonged heating cycles. Heat has become a growing factor as technological advances have boosted operating ...

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