TSMC Launches Unified Interconnect Modeling Format for Advanced Process Technologies.
PR Newswire Europe, May, 2009
HSINCHU, Taiwan, May 27 /PRNewswire/ --
- New iRCX Format Ensure Data Accuracy and Enables Extensive EDA Support of Interconnect Modeling Related Applications in TSMC 65nm and 40nm
Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) today unveiled iRCX, an interoperable electronic design automation (EDA) data format, for TSMC 65 nanometer (nm) and 40nm technologies.
iRCX format unifies interconnect modeling data delivery, ensures data integrity and interpretation. EDA tools which support iRCX format will be able to receive accurate interconnect modeling data from the iRCX files developed and supported by TSMC. Interconnect related EDA applications, including place & route, RC extraction, electromigration analysis,...
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