Business Services Industry
TAIWAN: Construction plans for proposed $230,000,000 wafer production expansion project, WINBOND ELECTRONICS CORP. [Taiwan] - Order #: 018703.
WWP-Business Opportunities in Asia & the Pacific, January, 2003
PROJECT OVERVIEW:
Taiwan-based WINBOND ELECTRONICS CORP. currently produces 5,000 wafers per month at its plant in Taiwan. Although the company initially planned to invest about $145,000,000 to upgrade its manufacturing operations WINBOND has now opted for a $230,000,000 expenditure.
In so doing, the company is planning to raise its production output by making use of 0.11 micron technology. As a result, WINBOND is expected to boost its output up to 20,000 wafers per month.
WINBOND employs a total staff of about 4,500. The company, Taiwan's second largest chipmaker, is involved in the design, production and marketing of integrated circuit chips.
COPYRIGHT (Cr) by WWP Inc. 2003 The data contained in this report may not be...
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