Business Services Industry
TAIWAN: Construction plans for proposed $252,000,000 wafer plant, WINBOND ELECTRONICS CORP. [Taiwan] - Order #: 022905.
WWP-Business Opportunities in Asia & the Pacific, February, 2005
PROJECT OVERVIEW:
The local, WINBOND ELECTRONICS CORP. recently signed a 5-year, $252,000,000 syndicated loan provided by 23 banks to fund the construction of its new 12-inch wafer plant located in Taichung, central Taiwan. In so doing, WINBOND expects to produce DRAMs for INFINEON TECHNOLOGIES by using 0.11-micron trench technology when the facility becomes operational.
Longer-term plans call for WINBOND's 12-inch factory to produce single-transistor pseudo-SRAM (1T PSRAM), using INFINEON's 90 nm technology, as well as other specialty memory chips. According to Arthur Yu-Cheng Chiao, WINBOND Chairman, the plant may also produce flash-memory chips, but at this stage the firm does not have a timeline for moving into flash production.
WINBOND...
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