Manufacturing Industry

Resin variant used to make more bendable circuit board.(Electronics)

New Materials Japan, June, 2005

Nippon Steel Chemical Co Ltd is increasing production of bendable circuit board materials for hard-disk drives by 50% after devising a variant on its existing polymide resin product.

The firm now uses dedicated facilities to turn out 16 000 m-2 a month but has recently improved the polyimide resin used in the circuit board materials as well as altered the temperature distribution in the furnaces, where the resin is hardened. The result is that the flexible circuit board materials can be made using the same equipment used to make circuit board materials for mobile phones, the company says.

As a result, it aims to boost production by 8000 m-2 per month by the last quarter of 2005. Nippon has already started shipping samples of materials made with the new...

Premium Content Partnership | HighBeam Research provides an in-depth online archive library of reference works. HighBeam Research

 

BNET TalkbackShare your ideas and expertise on this topic

Please add your comment:

  1. You are currently: a Guest |
  2.  

Basic HTML tags that work in comments are: bold (<b></b>), italic (<i></i>), underline (<u></u>), and hyperlink (<a href></a)

advertisement
advertisement
  • Click Here
  • Click Here
  • Click Here
advertisement
Click Here