Tiny Asian nations home to giant new chip plants. (Project Wire).(Brief Article)

Plants Sites & Parks, July, 2002

Two of the world's largest contract chip manufacturers are moving ahead with plans to build next-generation semiconductor plants in Taiwan and Singapore. Taiwan Semiconductor Manufacturing (TSMC)is breaking ground on two fabs, one in North Taiwan's Hsinchu science park and the other in the Tainan science park in south Taiwan.

Both labs will use 12-inch silicon wafer technology by the second half of 2002. United Microelectronics (UMC) is speeding up the schedule for its joint-venture semiconductor plant with Infineon in Singapore. The $3.6 billion UMC plant will also use 12-inch silicon wafers.