Polymer could improve semiconductor manufacturing.(MATERIALS)

High Performance Plastics, March, 2008

Researchers at Rensselaer Polytechnic Institute and Polyset Co, both USA, have developed a cheap, quick-drying polymer that could lead to dramatic cost savings and efficiency gains in semiconductor manufacturing and computer chip packaging.

Along with allowing enhanced performance and cost savings for conventional photolithography processes, the new material, called polyset epoxy siloxane (PES), should also enable a new generation of cheaper, on-chip nanoimprinting lithography technology, according to the researchers.

R.P. Baker Distinguished Professor of Physics at Rensselaer, Toh-Ming Lu, who oversaw the study, said "With this new material, chip manufacturers will be able to trim several steps from their production and packaging processes, and in...

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