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Articles in February, 2001 issue of CircuiTree

• Teradyne Connection Systems Expands Assembly Capacity.(Brief Article)(Statistical Data Included)
• IBM Unwraps Chip-Making Technology.(Brief Article)
• Sunrise Electronics, Orbotech Make Deal.(Brief Article)
• Graphic Plc Wins Green Award.(Brief Article)
• Celestica Forms Strategic Alliance with PartMiner, Motorola.(Celestica Inc., PartMiner Inc., Motorola Inc.)(Brief Article)(Statistical Data Included)
• LETTERS.
• Nonlinear-Time-Dependent Analysis of Micro Via-in-Pad Substrates for Solder Bumped Flip Chip Applications.
  by Chang, Chris; Lau, John H.; Lee, S. W. Ricky; Pan, Stephen H.
• CONTINUAL MOTION: COMPEQ'S 'FAST FORWARD' MANUFACTURING MODEL.(Company Profile)(Statistical Data Included)
  by GOLD, STEVE
• NEC to Sell Mobile Phone Division to Celestica.(Brief Article)
• Park Electrochemical Prevails in Lawsuit.(Brief Article)
• Data Circuit Systems Celebrates 22nd Anniversary.(Brief Article)(Statistical Data Included)
• A Myriad of Environmental Challenges Greet the New Millennium.(Brief Article)(Statistical Data Included)
  by GOOSEY, MARTIN
• Fine Line Generation Using Laser Technology.(production usages for lasers)(Brief Article)
  by SCHAEFFER, RONALD D.
• PPE Extends Electroless Nickel/Gold Capacity, Introduces Strategy Plan.(PPE Schopfheim)(Brief Article)(Statistical Data Included)
• Intel Develops World's Smallest, Fastest CMOS Transistor, Introduces Pentium 4.(Brief Article)
• Rogers Supplies Materials to IBM for Chip Package.(Brief Article)
• BPA Investigates Former Soviet Union PCB Industry.(Brief Article)
• Planning Your Break Away ...Methods for Creating Detachable Leads on Fine Line Flex.(Brief Article)
  by FJELSTAD, JOSEPH
• High Reliability/Low CTE Epoxy technology: An Overview of the Advantages of Low CTE Materials.(industry product developments)(Brief Article)(Statistical Data Included)
  by Forcier, Bob; Schor, Bob
• Nokia Sees Global Cell Phone Use Rising Faster than Expected.(Brief Article)
• Fine Lines in High Yield (Part LXV): Circuitizing Requirements Driven by Packaging Designs.(Brief Article)
  by DIETZ, KARL H.
• Intercept Technology Reveals IPC-D-356A Manufacturing Output Support, Compliance.(Brief Article)
• NatSteel Electronics to Spin Off ECS Holdings.(NatSteel Electronics Ltd., ECS Holdings Ltd.)(Brief Article)(Statistical Data Included)
• Uniting Cultures.(Brief Article)
  by COULTARD, FRANK
• Intel Building New Wafer Facility in Ireland.(Brief Article)
• Cisco Acquires ExiO Communications.(Brief Article)
• Orbotech Announces Agreement, Receives Orders.(Brief Article)
• Photoplotter Impact on Quality.(Statistical Data Included)
  by RHODES, RON
• HDI Production Using Pulse Plating with Insoluble Anodes.(Statistical Data Included)
  by Henny, Stephen; Matejat, Hai
• Nam Tai Electronics Expands COG.(chip on glass )(Brief Article)
• Rosenthal Manufacturing Mourns Loss of Founder Harry Rosenthal, 96.(Brief Article)(Obituary)
• DDi Named Among Best Managed Companies by EBN.(Brief Article)
• Ericsson to Focus on 3G Market Share, Joint Venture, Bluetooth.(Brief Article)
• Lloyd Doyle Reports More Installations.(Brief Article)
• Tests Show Compatibility for Stratos Lightwave.(Brief Article)
• Where are They Now? Dennis Stalzer: An Industry Pioneer Looks to the Future.
  by FEINBERG, DAN
• More Trends from Japan.(in semiconductor packaging)(Brief Article)
  by CHERVITZ, HARVEY
• Singapore's Circuits Plus Buys 20% Vector Fabrication.(Brief Article)
• Taiwan's UMC to Build $2.5 Billion Singapore Plant.(Brief Article)
• Dovehid[TM] Adds Asian Affiliates to Webcast Network.(Brief Article)
• Everett Charles Technologies Makes Deliveries.(Brief Article)
• Flextronics Qualifies UMC, Partners with Ericsson.(contract information)(Brief Article)
• Slowdown in Progress... What's the Six-Month Outlook?(Statistical Data Included)
  by CUSTER, WALT
• Hunter Technology Opens New EMS Facility.(Spokane, WA)(Brief Article)
• Alcatel's Asian Phone Equipment Orders Surged 90% in 2000.(Brief Article)(Statistical Data Included)
• MicroChem Named Among New England's Fastest Growing Companies.(Brief Article)
• PCB007 to Automate Web Quoting Procedure.(Brief Article)
• PEOPLE.
• TPCA 2000: SYNERGY IN TAIPEI.(Taiwan Printed Circuit Association trade show)(Brief Article)
  by Holzmann, Matt
• Labtech Triples Plating Capacity.(Brief Article)
• Global Warming, and What You Can Do About It.(Brief Article)
  by MARSHALL, HAROLD
• Motorola 3G Market in Asia, Working with Sega.(Brief Article)
• New Halogen-Free Flame Retardant From DSM Cuts Smoke Levels 25[degrees].(Brief Article)
• Coherent Acquires Crystal Associates.(Brief Article)
• Solectron Completes Acquisition of Sony Facility in Japan.(acquisition information)(Brief Article)
• Who's Next?(Alcedo and Exsight shut down)(Brief Article)
  by VAUCHER, CHRISTOPHE
• Toshiba, Others to Make LCDs for Cell Phones.(liquid crystal displays)(Brief Article)
• E-Business: Sinner or Saint?
  by HILVERS, TONY
• Taiwan's Acer Cuts Staff, Plants.(Brief Article)
• SDI.(Systems Division Inc.)(Brief Article)(Product Announcement)
• MP&P Effluent Guidelines Promise More Headaches.(Metal Products and Machinery Effluent Guidelines)(Brief Article)(Statistical Data Included)
  by GOLD, STEVE
• Sanmina Increasing Common Shares.(from 500 million to 1 billion)(Brief Article)(Statistical Data Included)