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Industry: Email Alert RSS FeedHoneywell launches new service bureau. (Fabrication).(Brief Article)
CircuiTree, May, 2002
Minneapolis, MN-The Advanced Circuits business of Honeywell introduced the FulFill[TM] Hole Fill Process used to fill high aspect vias. The patent-pending process is designed to fill, high aspect ratio PCB vias. Honeywell Advanced Circuits (HAC) has developed and demonstrated a fabrication process and equipment that it claims is simple in design, yet delivers high aspect ratio hole-fill capabilities at throughputs consistent with volume production demands. To meet increasing customer demands to fill high aspect vias, HAC has launched a service bureau offering the FulFill Hole Fill Process. The service bureau will provide both design and production assistance for filling high aspect ratio PCB vias.
In other news, Honeywell (HEM) said it is introducing lead-free...
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