IBM/STMICROELECTRONICS TO COLLABORATE ON CHIP TECHNOLOGY.

Electro Manufacturing, September, 2007

STMicroelectronics (NYSE:STM) and IBM (NYSE:IBM) have signed an agreement to collaborate on the development of next- generation process technology - the "recipe" that is used in semiconductor development and manufacturing.

The agreement includes 32-nanometer (nm) and 22nm complementary metal-oxide-semiconductor (CMOS) process-technology development, design enablement and advanced research adapted to the manufacturing of 300- millimeter (mm) silicon wafers. In addition it includes both the core bulk CMOS technology and value-added derivative System-on-Chip (SoC) technologies and positions both companies at the leading edge of technology development. The new agreement between IBM and ST will also include collaboration on IP development and platforms to speed the...

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