Characterization and Optimization of a Wave-Soldering Process.(Statistical Data Included)

Journal of the American Statistical Association, December, 1994 by LU, JYE-CHYI; MCKENZIE, RICHARD; MESENBRINK, PETER; TAHERI, JAVAD

JAVAD TAHERI*

A case study for improving the quality of a wave-soldering process that produced printed circuit boards (PCB's) is presented. A mixed-level fractional factorial design was implemented in a high-volume production system during normal operational hours. The observed ordered-categorical data from the bottom-side soldered leads were weighted to formulate the average, spatial uniformity, and dispersion process performance measurements. For lead classes like the integrated circuit and printed grid array, a polynomial model was established using the least squares method with weights provided by a dispersion function. The main-effect and interaction model terms were selected by forward and all-subsets regressions. Production quotas, topside defects,...

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