Manufacturing Industry
Bonding process for piezoelectric microactuators.(ELECTRONICS)
Advanced Ceramics Report, December, 2005
Using a novel precision bonding process, researchers at Pennsylvania State University (Penn State), USA, have designed and fabricated piezoelectric microactuators.
The microactuators are made from flat strips of bulk lead zirconate titanate (PZT) and a precision micromachined silicon beam. These were formed using photolithography and bonded with low temperature solders (200[degrees]C). In operation, the silicon beam buckles as the PZT shrinks when electrical energy is applied, converting the PZT into a distinctive convex bridge shape.
The measured deflection of the silicon beam shows a gain factor of 20 with respect to the PZT dimensional change, the researchers note.
The microactuators are capable of providing controlled force, high...
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