Detection and classification of defect patterns on semiconductor wafers

IIE Transactions, Dec, 2006 by Chih-Hsuan Wang, Way Kuo, Halima Bensmail

Friedman, D.J. and Albin, S.L. (1991) Clustered defects in IC fabrication: impact on process control charts. IEEE Transactions on Semiconductor Manufacturing, 4, 36-42.

Friedman, D.J., Hansen, V.N. and David, A.J. (1997) Model-free estimation of defect clustering in integrated circuit fabrication. IEEE Transactions on Semiconductor Manufacturing, 10, 344-359.

Gonalez, R.C. and Woods, R.E. (2001) Digital Image Processing, 2nd edn., Prentice-Hall.

Halkdi, M., Batistakis, Y. and Vazirgannis, M. (2001) On clustering validation techniques. Journal of Intelligent Systems, 17, 107-145.

Hansen, M.H., Friedman, D.J. and Nair, V.J. (1997) Monitoring wafer map data from integrated circuit fabrication process for spatially clustered defects. Technometrics, 39(3), 241-253.

Johnson, R.A. and Wichern, D.W. (2002) Applied Multivariate Statistical Analysis, 5th edn., Prentice-Hall, Upper Saddle River, NJ.

Jun, C.H., Hong, Y., Kim, S.Y., Park, K.S. and Park, H. (1999) A simulation-based semiconductor chip yield model incorporating a new defect cluster index. Microelectronics Reliability, 39, 451-456.

Kass, R.E. and Raftery, A.E. (1995) Bayes factors. Journal of the American Statistical Association, 90, 773-795.

Krishnapuram, R. and Freg, C.P. (1992) Fitting an unknown number of lines and planes to image data through compatible cluster merging. Pattern Recognition, 25(4), 385-400.

Krishnapuram, R., Nasraoui, O. and Frigui, H. (1992) The fuzzy C spherical shells algorithm: a new approach. IEEE Transactions on Neural Networks, 3, 663-671.

Kuo, W., Chien, K. and Kim, T. (1998) Reliability, Yield, and Stress Burn-in: A Unified Approach for Microelectronics Systems and Manufacturing and Software Development, Kluwer, Boston, MA.

Kuo, W. and Kim, T. (1999) An overview of manufacturing yield and reliability modeling for semiconductor products. Proceedings of the IEEE, 87(8), 1329-1346.

Liu, S.F., Chen, F.L. and Lu, W.B. (2002) Wafer bin map recognition using a neural network approach. International Journal of Production Research, 40, 2207-2223.

Raghavachari, M., Srinivasan, A. and Sullo, P. (1997) Poisson mixture yield models for integrated circuits: a critical review. Microelectronics Reliability, 37, 565-580.

Su, C.T., Yang, T. and Ke, C.M. (2002) A neural-network for semiconductor wafer post-sawing inspection. IEEE Transactions on Semiconductor Manufacturing, 15, 260-266.

Taam, W. and Hamada, M. (1993) Detecting spatial effects from factorial experiments: an application from integrated circuit manufacturing. Technometrics, 35, 149-160.

Biographies

Chih-Hsuan Wang received a PhD. in Operation and Technology Management from the National Taiwan University in 2005. He received a B.S. in Electronics Engineering from the National Chiao Tung University in Taiwan in 1993 and an M.S. in Electro-Optical Engineering from the National Taiwan University in 1995. Before he completed his Ph.D degree, he was awarded funds by the Taiwan National Science Council and the Education Ministry to support his Exchange Doctoral research in the USA. He has been a visiting scholar at Texas A & M University and a research scholar at the University of Tennessee. While at the University of Tennessee, he was involved in the NSF project "Defect pattern recognition on semiconductor wafers". He is now an Assistant Professor at Ming Chuan University and his current research interests include data mining, pattern recognition, signal processing, and image processing.


 

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