Dense-Pac Microsystems receives order from GEC Marconi Avionics valued at $2,900,000

Business Wire, July 19, 1995

GARDEN GROVE, Calif.--(BUSINESS WIRE)--July 19, 1995--Dense-Pac Microsystems Inc. (NASDAQ:DPAC) Wednesday announced that the company has agreed to sell to GEC-Marconi Avionics, Dense-Pac's first generation 3-Dimensional stackable memory product which will be utilized in the upgrade of avionic equipment.

The order is for a period of three years and is valued at $2,900,000, with the initial purchase order of $500,000 scheduled for delivery within the next 12 months.

James G. Turner, chief executive officer, said, "We are pleased to receive this order for our patented first generation product from GEC-Marconi with the product designed into a mass storage unit for avionics equipment. This order represents a significant win for Dense-Pac with its stackable memory technology."

Dense-Pac Microsystems Inc. is a designer and manufacturer of propriety computer chip stacking technologies that allows the company's government and commercial customers to pack huge amounts of memory into small spaces. Its memory technology can be used in such diverse areas as space satellites and space missiles, high performance auto engines, computers and cellular telephones.

CONTACT: Stern & Company

Richard Stern or Henry Ling, 212/777-7722

or

Dense-Pac Microsystems Inc.

William Stowell, 714/898-0007